Prouduct

Wireless Mcu Pcb Microcontroller Development Circuit Board

Specification of PCB ManufacturingProduct NameWireless Mcu Pcb Microcontroller Development Circuit Board MaterialsFR-4/HTG150-180 FR-4/CEM-1/CEM-3/AluminumLayercustomizedBoard Thickness0.2mm-0.4mmBoa

  • Model: Wireless Mcu Pcb Microcontroller Development Circuit Board

 Specification of PCB Manufacturing

Product NameWireless Mcu Pcb Microcontroller Development Circuit Board 
Materials

FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum

Layercustomized
Board Thickness0.2mm-0.4mm
Board Thickness Tolerance+/-10%
Copper Thickness17.5um-175um(0.5oz-5oz)

Min Trace Width

0.15mm

Min Space Width

0.15mm

Min Drilling Dia

0.2mm

Soldermask

green,red,blue,white,black,yellow,etc.
Suface Finish/Plating

HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG

Detailed Terms for Pcb Assembly

Quantity

Prototype&Low Volume PCB Assembly, from 1 Board to 250,is for specialty, but we can handle orders up to 1000.

Type of  Assembly

THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly.

Solder Type

Water Soluble Solder Paste, Leaded and Lead-Free.

Components

Passives parts, smallest size 0201;
BGA, uBGA, QFN, POP, and Leadless chips;
Fine Pitch to 0.8Mils;
BGA Repair and Reball; Part Removal and Replacement
Connectors and terminals.

Bare Board Size

Smallest: 0.25x0.25 Inches; Largest: 20x20 Inches.

File Formats

Bill of Materials Gerber Files Pick-N-Place File(XYRS).

Type of Service

Turn-Key, Partial Turn-Key or Consignment.

Component Packaging

Reels,cut tape,Tube and tray,Loose parts and bulk.

Turn Time

Same Day Service to 10 day service.

Testing

X-ray Inspection
AOI (Automated Optical Inspection)
ICT (In-Circuit Test)/Functional Testing