Specification of PCB Manufacturing
Product Name | Wireless Mcu Pcb Microcontroller Development Circuit Board |
Materials | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum |
Layer | customized |
Board Thickness | 0.2mm-0.4mm |
Board Thickness Tolerance | +/-10% |
Copper Thickness | 17.5um-175um(0.5oz-5oz) |
Min Trace Width | 0.15mm |
Min Space Width | 0.15mm |
Min Drilling Dia | 0.2mm |
Soldermask | green,red,blue,white,black,yellow,etc. |
Suface Finish/Plating | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
Detailed Terms for Pcb Assembly
Quantity | Prototype&Low Volume PCB Assembly, from 1 Board to 250,is for specialty, but we can handle orders up to 1000. |
Type of Assembly | THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly. |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free. |
Components | Passives parts, smallest size 0201; BGA, uBGA, QFN, POP, and Leadless chips; Fine Pitch to 0.8Mils; BGA Repair and Reball; Part Removal and Replacement Connectors and terminals. |
Bare Board Size | Smallest: 0.25x0.25 Inches; Largest: 20x20 Inches. |
File Formats | Bill of Materials Gerber Files Pick-N-Place File(XYRS). |
Type of Service | Turn-Key, Partial Turn-Key or Consignment. |
Component Packaging | Reels,cut tape,Tube and tray,Loose parts and bulk. |
Turn Time | Same Day Service to 10 day service. |
Testing | X-ray Inspection AOI (Automated Optical Inspection) ICT (In-Circuit Test)/Functional Testing |