ArticleDescriptionCapabilityMeterialLaminate materialsFR4, Hight-TG FR4, Frequency, FPC, Alum, Etc.Board cuttingNumber of layers1---60Finised inner1---6 OZBoard thicknessStandard0.1---4MMMinSingle/Dou
| Article | Description | Capability |
| Meterial | Laminate materials | FR4, Hight-TG FR4, Frequency, FPC, Alum, Etc. |
| Board cutting | Number of layers | 1---60 |
| Finised inner | 1---6 OZ | |
| Board thickness | Standard | 0.1---4MM |
| Min | Single/Double:0.008±0.004" | |
| 4 layer:0.01±0.008" | ||
| 8 layer:0.01±0.008" | ||
| Bow and twist | No more than 7/‰ | |
| Copper weight | Outer Cu weight | 0.5---4 OZ |
| Inner CU weight | 0.5---3 OZ | |
| Drilling | Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
| Drill deviation | ±0.05MM(0.002") | |
| PTH hole tolerance | ±0.005MM(0.002") | |
| NPTH hole tolerance | ±0.005MM(0.002") | |
| Solder mask | Color | Blue, green, white, black, red, etc. |
| Min solder mask clearanace | 0.007MM(0.003") | |
| Thickness | 0.017MM(0.012") | |
| Color | Blue, white, black , yellow, etc. | |
| Silkscreen | Min size | 0.15MM(0.006") |
| Function test | 100% functional test | |
| Test | PCBA testing | AOI, X-RAY, functional test |
| Certificate | IATF 16949, ISO9001, ISO14001 | |
| Delivery time | PCB | 2---15 days |
| PCBA | 7---20 days | |
| Max size of finish board | 600 x 600MM | |
| Controlled Impedance | ±5% | |
| Surface finish | ENIG, HASL, Immersion Tin, OSP, Immersion silver | |
| PCB outline | Circle, square, irregular | |
| Packaging | Bubble Bag Vacuum, cartoon, etc. | |
| MOQ | No MOQ | |