3Port USB Phone Charger PCB
Prodauct name | OEM Quick Charger 3.0 Dual Usb Synchronous Rectification PCBA |
Layer count | 1-16 layers |
Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,teflon,rogers,nelco |
Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz |
Board thickness | 8-236mil(0.2-6.0mm) |
Max. panel size | 32"X20"(800X508mm) |
Min.line width/space | 3/3 mil(75/75um) |
Min. innerlayer annular ring | 4 mil(0.10mm) |
Min. core thickness | 4 mil(0.10mm) |
Surface treating of innerlayer | brown oxide |
Innerlayer ragistration | 3 mil(76um) |
Tolerance of board thickness | +/- 12-10 % |
Min. drill size | 8 mil(0.2mm) |
Min. HDI laser drill size | 3 mil(0.067mm) |
Tolerance of hole size | 2 mil(0.05mm) |
Tolerance of hole position | 2 mil(0.05mm) |
Max. aspect ratio | 10:01 |
PTH copper thickness | 1 mil(25 um) |
Solder mask color | Green,blue,yellow,white,black,red |
Solder mask thickness | 5-30um |
Solder mask hardness | 6H |
Min. solder mask dam | 3 mil(75um) |
Max. hole size of S/M plug | 24um(0.6mm) |
Peelable solder mask | yes |
carbon ink | yes |
surface treating | HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger |
Nickel thickness | 120-240u"(3-6um) |
Gold thickness | 2-30u" (0.05-0.76um) |
Impedance control | Ohms+/-10% |
Blind hole/buried hole | yes |
Half hole | yes |
Sink hole | yes |
HDI | 1+1+N+1+1 |
VOP | yes |
Rouuting tolerance | +/- 6um(0.15mm) |
V-cut | yes |
Solderability test | 245' C, 5S |
Thermal stress test | 280 ℃/10 secs |
Feel strength of line | ≥61B/In(≥ 107g/mm)
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